Our department is one of the leading institutions in engineering education and renowned for its world-class researches. We offer a comprehensive curriculum, uniquely merging the core chemical engineering courses with the essences of materials science/engineering. Our diverse research and teaching interests include: Biochemical & biomedical engineering, catalysis & reactor design, thermodynamics (chemical, solid-state, fluid-phase equilibrium), colloid & interface science, electrochemistry, packaging of electronic materials, novel material synthesis, polymer science & engineering, and soft matter physics & materials.

Dr. Cheng-Yi LiuProfessor Office Phone: +886-3-4227151#34228 E-mail: chengyi@cc.ncu.edu.tw Office: E3-218 Lab: E3-218 Education: Research Interests: Light Emission Diode (LED), Wafer-bonding, Flip-chip Package, Lead-free solder, Electromigration and thermalmigration
Research Background
Thesis Publications
Selected publications:
1. C. L. Lin, P. H. Chen, C. H. Chan, C. C. Lee, C. C. Chen, J. Y. Chang and C. Y. Liu, "Light enhancement by the formation of an Al-oxide honeycomb nano-structure on the n-GaN surface of thin-GaN LED", Appl. Phys. Letts., vol. 90, (24), 242106, (2007)
2. P. H. Chen, C. L. Lin, C. Y. Liu, "Amorphous Si/Au wafer bonding", Appl. Phys. Letts., vol. 90, (13), 132120 (2007)
3. S. J. Wang and C. Y. Liu, "Coupling Effect in Pt/Sn/Cu Sandwich Solder Joint Structure", Acta Materialia, vol. 55, (10), 3327-3335 (2007)
4. 王信介、高慧茹、劉正毓,"覆晶無鉛Sn(Cu)/Ni(P)墊層界面反應及其對銲點強度之影響研究",界面科學會誌,vol. 26, pp89-98, (2004)。
Research project